Copper etchant

Supplier: Thermo Scientific
Danger

Synonyms: Copper etching solution

44583.XC 44583.WY
44583.XCEA 367 EUR
44583.XC 44583.WY
Copper etchant
Copper etchant

Applications: Iron (III) chloride solution for immersion etching copper, copper alloys and Kovar in printed circuit board applications


Physical Form: Liquid Density: 1.19 Appearance: Dark yellow to brown Odour: Acidic UN No.: UN3264 MDL No.: MFCD00161912


Applications: Iron (III) chloride solution for immersion etching copper, copper alloys and Kovar in printed circuit board applications

Density: 1,19
Storage Temperature: Ambient
MDL Number: MFCD00161912
UN: 3264
ADR: 8,III

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